Comprehensive Analysis of 15 Types of Rigid PCBs Features, Applications, and Future Trends
Author: Jack Wang
Rigid PCBs serve as the "skeletal system" of electronic devices, accounting for over 75% of the global PCB market. This article provides an independent analysis of 15 mainstream rigid PCB types, detailing their technical specifications, typical applications, and market forecasts. All data is sourced from authoritative industry reports.
1. Single-Sided PCB
Features:
Single conductive copper layer (35μm thickness)
FR-4 substrate, dielectric constant 4.5@1MHz
Minimum line width/spacing: 0.3mm/0.3mm
Applications:
Consumer electronics (remote controls, electronic scales)
Accounts for 62% of PCBs in low-end global electronics
Market Trends:
2024 market size: $2.8 billion, 1.8% YoY growth (Prismark)
Gradually being replaced by double-sided boards but retains stable demand for low-power devices
2. Double-Sided PCB
Features:
Plated through-holes (minimum 0.3mm diameter)
Impedance control ±15%
60% higher wiring density than single-sided boards
Applications:
Industrial controllers (PLCs, sensors)
Home appliance control boards (AC units, washing machines)
Market Trends:
2025 market size: $5.3 billion, CAGR 3.2%
Transitioning to advanced HDI technology
3. High-Layer Count PCB (8-60 Layers)
Features:
Minimum 3 lamination cycles, thickness 1.6-6mm
Inner layer copper thickness: 17-70μm options
Signal integrity control (Skew ≤5ps/inch)
Applications:
Server/switch motherboards (20+ layers per board)
Medical imaging equipment (CT scanner control boards)
Market Trends:
AI server demand driving market to $8.7 billion by 2026
Layer counts progressing to 30+ (Nvidia H100 GPU substrate reaches 26 layers)
Technical Product Analysis of Rigid High-Layer Count PCBs and Application Practices
4. HDI PCB
Features:
Laser micro-vias (≤100μm diameter)
Any-layer interconnect technology
Line width/spacing down to 40/40μm
Applications:
Smartphone motherboards (iPhone 15 uses 10-layer any-layer)
Wearable devices (Apple Watch Ultra)
Market Trends:
2024 global market: $15.2 billion, CAGR 8.7%
Driven by 60%+ 5G smartphone penetration rate
Engineering Characteristics and Technical Practice Guide for HDI (High-Density Interconnect) PCBs
5. High-Frequency PCB
Features:
Low-Dk materials (Rogers 4350B, Dk=3.48)
Loss tangent ≤0.003@10GHz
Surface roughness Ra ≤0.5μm
Applications:
5G base station antennas (28/39GHz bands)
Satellite communication terminals
Market Trends:
2027 market size: $2.4 billion (Grand View Research)
6G R&D driving 110GHz+ frequency requirements
6. High-Speed PCB
Features:
Insertion loss ≤0.2dB/inch@56Gbps
Differential impedance 100Ω±7%
1080/3313 glass fabric specifications
Applications:
Data center optical modules (800G transmission)
Autonomous driving domain controllers
Market Trends:
224Gbps standards driving 12% demand growth by 2025
Low-loss materials (MEGTRON 7) gaining market share
7. Mini LED PCB
Features:
Pad size ≤100μm (0.2mm pitch)
CTE matching LED chips (14ppm/℃)
White solder mask reflectivity ≥92%
Applications:
TV backlight modules (Samsung Neo QLED)
Automotive displays (Tesla Model S Plaid)
Market Trends:
2024 shipments exceeding 25 million units (DSCC)
Glass substrate adoption surpassing 15% (TCL CSOT technology)
Mini LED PCB Engineering Practical Guide Comprehensive Analysis from Design to Mass Production
8. Metal-Core Copper PCB
Features:
Thermal conductivity 380W/mK
Operating temperature -50℃~300℃
Insulation layer thermal conductivity 1.5W/mK
Applications:
High-power LED modules (1000W+)
High-speed rail traction converters
Market Trends:
New energy power equipment driving market to $780 million by 2025
Costs 3× higher than aluminum-core, limited to premium applications
9. Metal-Core Aluminum PCB
Features:
Thermal conductivity 1-3W/mK
40% lower cost than copper-core
60% lighter than FR-4
Applications:
LED street lights (200W/m² thermal demand)
Photovoltaic inverters
Market Trends:
Holds 75% share of metal-core PCB market
EV charging piles driving 9% annual growth
10. Metal-Core Iron PCB
Features:
EMI shielding ≥30dB@1GHz
Mechanical strength 500MPa
Costs 1/5 of copper-core
Applications:
Industrial motor drivers
Induction cooktop control boards
Market Trends:
Market shrinking to $120 million due to silicon steel competition
Niche demand in specialty equipment (MRI machines)
11. Metal-Core Stainless Steel PCB
Features:
Corrosion resistance (passes 96h salt spray test)
Yield strength ≥600MPa
CTE 11.5ppm/℃
Applications:
Marine monitoring equipment
Chemical instrumentation
Market Trends:
2024 market size: $80 million (niche market)
Deep-sea exploration driving 7% growth
12. Ceramic Alumina PCB
Features:
Thermal conductivity 24-28W/mK
Dielectric strength 15kV/mm
CTE 6.5ppm/℃
Applications:
Laser diode packaging (fiber optics)
Spacecraft power modules
Market Trends:
2025 market: $430 million, CAGR 6.5%
Facing substitution pressure from aluminum nitride
13. Ceramic Aluminum Nitride PCB
Features:
Thermal conductivity 170-230W/mK (8× alumina)
Flexural strength 320MPa
Dielectric constant 8.8@1MHz
Applications:
IGBT modules (Tesla Model Y)
RF microwave devices (5G base stations)
Market Trends:
2026 market: $670 million, CAGR 11.2%
Localization rate surpassing 30% (Chaozhou Three-Circle mass production)
14. IC Substrate PCB
Features:
Line width/spacing ≤2μm
Warpage ≤0.1%
300℃/10s heat resistance
Applications:
Advanced packaging (TSMC CoWoS)
Memory chips (Samsung HBM3)
Market Trends:
2025 market: $21.4 billion
Driven by 2.1D/3D packaging technologies
15. Halogen-Free PCB
Features:
Halogen content ≤900ppm (Cl+Br)
UL 94 V-0 flame rating
Thermal decomposition temperature ≥325℃
Applications:
EU export electronics
EV battery management systems
Market Trends:
45% market penetration by 2027
EU regulations driving 12% annual growth
Technology Roadmap
PCB Type | 2024 Key Metrics | 2026 Breakthrough Targets |
HDI PCB | 30/30μm lines | Sub-20μm ultra-fine lines |
High-Frequency | Dk=2.5@77GHz | Terahertz frequency materials |
IC Substrates | 2μm line width | Sub-1μm semiconductor processes |
Data Sources: Prismark, Yole Development, IPC Standards, Corporate Financial Reports
Author: Jack Wang